Ovaviu bilong Prodak
MMCX-C-J1.5 em i wanpela MMCX meri krimp-taip konekta we kampani bilong mipela i wokim stret long ol liklik RF aplikesen. Wanpela gutpela prodak insait long ol liklik konekta lainap bilong mipela, em i holim yet gutpela 360-digri roteting lok we i stap long MMCX series taim em i yusim wanpela gutpela 'crimp structure' long givim wanpela hariap, gutpela terminesen solusen bilong ol liklik-diamita RF kebol olsem RG174 na RG316. Em i gat gutpela 'vibration resistance' na i stap longpela taim long envairomen, na em i wanpela gutpela rot bilong stretim hevi we ol i wokim bilong inapim ol 'miniaturisation' na 'high-density integration' insait long ol nupela masin bilong toktok.
As tingting bilong wok
MMCX-C-J1.5 i yusim wanpela kain 'push-on coupling mechanism, na i save kamapim kwik koneksen na 360-fri rotesen long rot bilong wanpela gutpela intanel snap-fit straksa. Taim ol i bungim wantaim dispela 'plug', ol 'elastic contacts' insait long en i save kamapim wanpela gutpela, 'low-impedance electrical path' wantaim 'center pin' bilong 'plug'. Disain bilong 'crimp' i yusim ol spesel tul long pasim bodi bilong konekta long baksait bilong kebol (sil) na 'insulation layer' bilong kebol. Dispela i mekim na ol i gat gutpela lektrik koneksen na gutpela signal transmisen pefomens maski long ol hatpela ples we i gat 'vibration' na 'shock'.
Ol samting na pleting
|
Meteriel |
Pleting |
|
|
Bodi |
Bras |
Au |
|
Senta kondakta |
QSn6.5-0.1 |
Au |
|
O-ring |
silikon raba |
|
|
Insulata |
PTFE |
Elektrikel
|
Impedens |
50Ω |
|
Frekwensi Renj |
0-6GHz |
|
VSWR |
<1.25 |
|
Wok Voltej |
250V |
|
Stap strong long voltej |
750V |
|
Senta Kontek Resistans (mΩ) |
Liklik o wankain olsem 5 |
|
Outer Contact Resistance(mΩ) |
Liklik o wankain olsem 2.5 |
|
Durability |
500 saikel |
Ol Aplikesen
Ol intanel jampa kebol bilong komunikesen beis stesin ikwipmen
Ol antena fid lain bilong GPS na GNSS sistem
Ol koneksen bilong WLAN na Bluetooth modul
Ol kebol bilong skelim na skelim ol samting
Ol samting bilong balus na difens
Ol masin we yu ken karim i go i kam we i nidim planti taim na tanim tanim 360-digri
Ol stia tok bilong putim
Redim ol kebol: Bihainim gut ol piksa bilong 'dimension' we kampani bilong mipela i givim long rausim 'cable jacket', 'shield', na 'insulation', na mekim stretpela 'dimension' bilong olgeta wan wan leia.
Tul bilong 'Crimping': Yu mas yusim spesel 'crimping' tul we mipela i rekomendim long mekim gutpela 'crimp' na 'electrical performance' bilong konekta.
Sekim klinpela: Pastaim long yu 'crimping', plis sekim olsem insait bilong konekta na 'cable end face' i klin na i no gat pipia long en bilong lukim olsem koneksen i gutpela.
Crimping Force: Pinisim wok bilong 'crimping' long wanpela 'stroke' tasol. Noken 'crimping' planti taim long stopim 'deformation' bilong 'sleeve' o bagarap long 'cable'.
Wok bilong painim poroman: Taim yu konektim o rausim MMCX plug, plis holim bodi bilong konekta. Noken pulim kebol stret long stopim bagarap long 'crimp joint'.
Tok bilong pinisim
Long Zhenjiang Tongda Electronic, mipela i klia tru olsem long ol nupela ilektronik divais we olgeta milimita i bikpela samting, olgeta liklik konekta i gat bikpela wok long mekim gutpela wok bilong salim signal. MMCX-C-J1.5 em i no wanpela 'crimped interface' tasol long pinis bilong wanpela kebol; em i makim bikpela save bilong mipela long skelim "miniaturization na hai pefomens." Stat long wok bilong kamapim ol gutpela 'mold' i go inap long ol wok sekim bilong faktori, mipela i gat strongpela tingting long mekim dispela liklik konekta i kamap wanpela gutpela na strongpela signal hab insait long ol 'high-density circuit' disain bilong yu. Sapos yu makim Tongda, yu mas makim wanpela poroman husat i kliagut long teknoloji na i tingim kwaliti. Yumi mas konektim long wanpela bikpela bihain taim wantaim.
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