Ol RF kebol em i wanpela bikpela samting bilong salim ol signal long bikpela - frikwensi, na wok bilong wokim ol i save mekim wok bilong ol long pawa na wok bilong ol long wok gut. Wok bilong wokim 'mold' i mas skelim gut ol samting bilong en, disain bilong straksa, na stretpela wok bilong wokim ol samting bilong mekim signal i stap gut na i ken senis long ol kompleks aplikesen envairomen.
Seleksen bilong ol samting na pretritmen em i bikpela samting long wokim 'moulding'. Ol RF kebol i save gat wanpela insait kondukta (olsem kopa waia o silva-plet kopa waia), wanpela insulesen leia (olsem polytetrafluoroethylene (PTFE) o polyethylene (PE), wanpela shielding leia (braided kopa mesh o aluminium foil), na wanpela ausait jaket (olsem PVC insulesen materiel o i mas stap). i gat liklik 'dielectric constant' na 'loss tangent' bilong daunim 'signal atenuation', na 'shielding layer' i mas gat bikpela 'coverage' bilong daunim 'electromagnetic interference'. Long taim bilong 'pretreatment', ol i mas klinim na 'anneal' kondakta long daunim hevi na mekim 'ductility' i kamap gutpela, na bai i gat gutpela 'dimensional stability' long taim bilong 'moulding' bihain.
'Estrusion' na 'insulation molding' em ol bikpela step. Ol i putim 'insulation layer' long pes bilong 'conductor' long rot bilong yusim wanpela 'precision extruder'. Ol i save yusim ol 'nitrogen assist' o 'high-tempereture molds long bosim 'expansion coefficient' bilong ol samting olsem PTFE long stopim ol 'bubble' na 'eccentricity'. Long ol multi-lea straksa, ol i save laminetim insulesen na shielding leit bihain long leit long rot bilong planti ekstrusen proses, wantaim 'thickness uniformity' we ol i save sekim long taim stret long yusim wanpela 'online capacitance tester'.
Integresen bilong 'braid' na 'shield' i save givim hevi long ol 'anti-interference capabilities. Ol i save yusim wanpela hai-spid masin bilong pasim 'shielding layer', na ol i save karamapim kopa o tin kopa waia long wanpela spesifik angle (olsem, 45 digri -60 digri ). Density i mas winim 90% long kamapim wanpela Faraday keis ifek. Sampela hai-kebol i kamap gutpela moa yet long rot bilong 'longitudinal wrapping' bilong 'aluminium-plastic composite tape'. Dispela step i nidim strongpela 'tension control' long stopim 'conductor' long lusim ples o bagarap long 'insulation'.
Moulding bilong ausait bilong 'sheath' na 'post-prosesing i pinisim laspela proteksen. Ol i save meltim ol samting bilong 'sheath' long bikpela hat insait long wanpela 'extruder' na bihain ol i putim long 'shielding layer'. Bihain em i go insait long wanpela tenk wara bilong mekim em i kol na bai em i ken kamap raunpela hariap. Ol spesel aplikesen (olsem 'aerospace') i ken nidim wanpela moa 'radiation cross-linking' proses bilong helpim tempereja na 'abrasion resistance'. Kebol we i pinis i save go insait long 'high-' frikwensi tes (olsem VSWR vektor netwok analisis) na 'mechanical performance verification' (olsem 'flex life testing') long lukim olsem em i bihainim ol standet bilong indastri.
Wok bilong wokim RF kebol i stap long mak bilong saiens bilong ol samting, kontrol bilong masin, na tiori bilong elektromagnetik. Level bilong sofistikesen bilong en i save makim stret wok bilong ol komunikesen sistem. Wantaim divelopmen bilong 5G na setelait komyunikesen, askim bilong ol 'ultra-low-loss, ol 'highly flexible' kebol bai go het long kirapim ol nupela proses.